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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCU0805MC1002FP500
- Part Number MCU0805MC1002FP500
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCU0805MC1002FP500 Details
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Manufacturer Part Number:
MCU0805MC1002FP500
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Germany, Israel
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
MCU0805MC1002FP500 Frequently Asked Questions (FAQs)
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The recommended land pattern for MCU0805MC1002FP500 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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Yes, the MCU0805MC1002FP500 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the application's operating conditions are within the specified limits.
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The MCU0805MC1002FP500 is a moisture-sensitive device (MSD). To prevent damage, it's essential to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering if they've been exposed to moisture.
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The recommended reflow soldering profile for MCU0805MC1002FP500 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. It's essential to follow the recommended profile to ensure proper soldering and minimize the risk of component damage.
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Yes, the MCU0805MC1002FP500 is AEC-Q200 qualified, making it suitable for automotive applications. However, it's essential to ensure that the component meets the specific requirements of the application, including operating temperature, voltage, and reliability requirements.
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MCU0805MC1002FP500 Overview
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