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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCU0805MC4702FP500
- Part Number MCU0805MC4702FP500
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCU0805MC4702FP500 Details
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Manufacturer Part Number:
MCU0805MC4702FP500
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Germany, Israel
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
MCU0805MC4702FP500 Frequently Asked Questions (FAQs)
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The recommended land pattern for MCU0805MC4702FP500 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While the MCU0805MC4702FP500 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in high-temperature applications. Ensure proper heat sinking and follow the recommended operating conditions to avoid overheating and potential failures.
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To prevent electrostatic discharge (ESD) damage, handle the MCU0805MC4702FP500 with proper ESD protection measures, such as using an ESD wrist strap, mat, or workstation. Ensure that the device is stored in an ESD-safe environment and follow the recommended handling procedures.
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The recommended soldering profile for MCU0805MC4702FP500 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the recommended specifications to avoid damaging the component.
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While the MCU0805MC4702FP500 is a robust component, it's essential to consider the mechanical stress and vibration in high-vibration or high-shock applications. Ensure proper mounting and securing of the component, and consider additional mechanical support or potting compounds if necessary.
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MCU0805MC4702FP500 Overview
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