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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MCU0805MD2211BP100
- Part Number MCU0805MD2211BP100
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCU0805MD2211BP100 Details
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Manufacturer Part Number:
MCU0805MD2211BP100
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Germany, Israel
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
14
MCU0805MD2211BP100 Frequently Asked Questions (FAQs)
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The recommended land pattern for MCU0805MD2211BP100 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While the MCU0805MD2211BP100 is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management in your design. Ensure that the component is not exposed to temperatures above 150°C for extended periods, and provide adequate heat dissipation to prevent thermal runaway.
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The MCU0805MD2211BP100 is a moisture-sensitive device (MSD) with a MSL rating of 3. To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures before reflow soldering.
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The recommended reflow soldering profile for MCU0805MD2211BP100 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. Ensure that the temperature ramp-up rate is 3°C/s or less to prevent thermal shock.
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While the MCU0805MD2211BP100 is a robust component, it's essential to consider the vibration and shock requirements in your design. Ensure that the component is properly secured to the PCB, and consider using underfill or potting compounds to enhance mechanical stability.
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MCU0805MD2211BP100 Overview
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