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MCZ33999EK - NXP

Description: Power Switch ICs - Power Distribution 16 LOW SIDE PWM&SPI

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MCZ33999EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 54 SOICW-EP
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MCZ33999EK - NXP  - 3D model - Small Outline Packages - 54 SOICW-EP
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MCZ33999EK Details

  • Manufacturer Part Number:

    MCZ33999EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    0.65 MM PITCH, ROHS COMPLIANT, SOIC-54

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    16

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    SIPO BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G54

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    54

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP54,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    27 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3.1 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    10 µs

  • Width:

    7.5 mm

MCZ33999EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12273, which includes guidelines for component placement, routing, and thermal management.
  • The MCZ33999EK has a low-power mode that can be enabled by setting the PMIC_EN pin low and configuring the power modes using the I2C interface. Refer to the datasheet section 10.3 for more details.
  • The maximum current rating for the USB OTG port is 1.5A, as specified in the datasheet section 6.3.
  • The MCZ33999EK has a built-in thermal sensor that can be used to implement over-temperature protection. The thermal sensor output can be monitored using the I2C interface, and the system can be shut down or throttled back when the temperature exceeds a certain threshold.
  • Yes, the MCZ33999EK is designed to be compatible with a wide range of processors, including those from other manufacturers. However, NXP provides optimized software and hardware support for NXP processors.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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