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MD1715K6-G - Microchip

Description: Gate Drivers 2CH 5 LEVEL HI-SPEED ULTRASOUND DRIVER ±4.75 to 12.9V Gate Drive Voltage • 1.8V to 3.3V CMOS Logic Interface

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PCB Footprints
MD1715K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40-LEAD QFN
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3D Models
MD1715K6-G - Microchip  - 3D model - Quad Flat No-Lead - 40-LEAD QFN
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MD1715K6-G Details

  • Manufacturer Part Number:

    MD1715K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    VQFN-40

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    12.9 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

MD1715K6-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device.
  • Use a reliable communication protocol (e.g., SPI or I2C) and ensure proper signal termination. Use a pull-up resistor (e.g., 1kΩ) on the SCL/CLK line and a pull-down resistor (e.g., 1kΩ) on the SDA/MOSI line.
  • Power up the device in the following sequence: VDD, VCC, and then the input voltage (VIN). Ensure that the power supplies are stable and within the recommended voltage range before applying the input voltage.
  • Use a heat sink with a thermal resistance of ≤ 10°C/W. Ensure good airflow around the device and avoid blocking the airflow. Use thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.
  • Handle the device by the body or the pins, avoiding touching the die. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Store the device in an anti-static bag or container.

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MD1715K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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