The recommended land pattern for the MDMK2020T3R3MM is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm.
During reflow soldering, the MDMK2020T3R3MM should be placed on a flat surface, and the peak reflow temperature should not exceed 260°C for a maximum of 30 seconds.
The maximum operating temperature range for the MDMK2020T3R3MM is -40°C to 125°C, with a derating of 1.25% per °C above 85°C.
The MDMK2020T3R3MM should be stored in a dry, cool place, away from direct sunlight and moisture. If the component is exposed to air for an extended period, it should be baked at 125°C for 24 hours to remove any absorbed moisture.
The recommended soldering method for the MDMK2020T3R3MM is reflow soldering, using a solder paste with a melting point of 217°C to 220°C.
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MDMK2020T3R3MM Overview
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