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MDP1603100RGE04 - Vishay

Description: Resistor Networks & Arrays 100ohms 16pin 2%

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MDP1603100RGE04 - Vishay - PCB symbol
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MDP1603100RGE04 - Vishay PCB footprint - Other - Other - MDP1603100RGE04-3
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MDP1603100RGE04 - Vishay - 3D model - Other - MDP1603100RGE04-3
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MDP1603100RGE04 Details

  • Manufacturer Part Number:

    MDP1603100RGE04

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP, ROHS COMPLIANT

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.15

  • Construction:

    Molded Case

  • Element Power Dissipation:

    0.25 W

  • First Element Resistance:

    100 Ω

  • Lead Length:

    3.3 mm

  • Lead Spacing:

    2.54 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.05 mm

  • Package Length:

    21.59 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    DIP

  • Package Width:

    6.35 mm

  • Packing Method:

    TUBE

  • Rated Power Dissipation (P):

    1.92 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Size Code:

    8525

  • Surface Mount:

    NO

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Temperature Coefficient Tracking:

    50 ppm/°C

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Shape:

    FLAT

  • Tolerance:

    2%

MDP1603100RGE04 Frequently Asked Questions (FAQs)

  • Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable soldering, follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30-45 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C, and avoid using excessive solder or flux.
  • The maximum allowed voltage derating for the MDP1603100RGE04 is 80% of the rated voltage. This means that if the rated voltage is 1000V, the maximum allowed voltage derating would be 800V.
  • While the MDP1603100RGE04 is suitable for high-frequency applications, its performance may degrade above 100 kHz. For frequencies above 100 kHz, consider using a more specialized high-frequency capacitor or consult with a Vishay application engineer.
  • The MDP1603100RGE04 is a moisture-sensitive device. To prevent damage, store the components in a dry environment (RH < 30%) and follow the recommended baking procedure before soldering: 125°C for 24 hours or 150°C for 12 hours.

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MDP1603100RGE04 Overview

Use the download button to access the MDP1603100RGE04 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MDP16, or try a keyword search, such as Array/Network Resistors

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MDP1603100RGE04 Alternates

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Part Image MDP1603101G Vishay Intertechnologies

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 3W, 2% +/-Tol, 100ppm/Cel, Through Hole Mount, DIP
Part Image MDP1603100RGE04 Vishay Dale

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Part Image MDP1603100RGD04 Vishay Intertechnologies

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.92W, 100ohm, 2% +/-Tol, 100ppm/Cel, Through Hole Mount, 8525, DIP