MEJ2S1215SC - Murata Electronics

MEJ2S1215SC Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the MEJ2S1215SC?
  Murata recommends a land pattern with a pad size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.2mm between the pad and the solder mask.
• How do I handle the MEJ2S1215SC during reflow soldering?
  Murata recommends a peak reflow temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It's also important to ensure that the component is properly aligned and secured during the reflow process to prevent movement or tombstoning.
• What is the maximum operating temperature range for the MEJ2S1215SC?
  The MEJ2S1215SC is rated for operation from -40°C to +125°C, with a derating of 1.25mΩ/°C above 80°C.
• Can I use the MEJ2S1215SC in a high-vibration environment?
  Yes, the MEJ2S1215SC is designed to withstand vibrations up to 10G (10Hz-2kHz) and shocks up to 100G (11ms) according to IEC 60068-2-6 and IEC 60068-2-27, respectively.
• How do I ensure the reliability of the MEJ2S1215SC in a humid environment?
  Murata recommends following the IPC/JEDEC J-STD-020 standard for moisture sensitivity, and ensuring that the component is stored in a dry environment (less than 30% RH) and baked according to the recommended schedule before reflow soldering.