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MIC4832YMM - Microchip

Description: LED Lighting Drivers 220Vpp Low Noise EL Driver

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MIC4832YMM - Microchip - PCB symbol
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MIC4832YMM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MIC4832YMM
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MIC4832YMM - Microchip - 3D model - Small Outline Packages - MIC4832YMM
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MIC4832YMM Details

  • Manufacturer Part Number:

    MIC4832YMM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MIC4832YMM Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid copper plane on the PCB underneath the MIC4832YMM, and to use thermal vias to connect the plane to the device's thermal pad. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it is essential to follow proper thermal design and layout guidelines, as mentioned earlier. Additionally, it is recommended to derate the device's output current and voltage according to the temperature derating curves provided in the datasheet. It is also important to ensure that the device is operated within its specified junction temperature range (TJ) of -40°C to 125°C.
  • The recommended input capacitor for the MIC4832YMM is a low-ESR ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of 6.3V or higher. For the output, a low-ESR ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 2.5V or higher is recommended. The capacitor values and types may vary depending on the specific application requirements and PCB layout.
  • To troubleshoot issues with the device's enable pin, first ensure that the enable pin is properly connected to a logic-level input signal. Verify that the input signal is within the specified voltage range (0.8V to 2.4V) and that it is not floating or shorted to any other pin. Also, check that the enable pin is not being driven by a signal with excessive slew rate or ringing, which can cause the device to malfunction.
  • The recommended method for soldering the MIC4832YMM is to use a reflow soldering process with a peak temperature of 260°C or lower. The device is sensitive to excessive heat and moisture, so it is essential to follow proper soldering and handling procedures to prevent damage. Hand soldering is not recommended due to the device's small size and thermal sensitivity.

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MIC4832YMM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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