Description:Monolithic Construction; Collector-Emitter Sustaining Voltage VCEO(sus) = 150 Vdc (Min) MJH11018, 17 VCEO(sus) = 200 Vdc (Min) - MJH11020, 19 VCEO(sus) = 250 Vdc (Min) - MJH11022, 21; Low Collector-Emitter Saturation Voltage VCE(sat) = 1.2 V (Typ) @ IC = 5.0 A VCE(sat) = 1.8 V (Typ) @ IC = 10 A; High DC Current Gain @ 10 Adc - hFE = 400 Min (All Types); Pb-Free Packages are Available
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
Handle the device in an ESD-controlled environment. Use ESD-protective packaging and handling materials. Ground yourself before handling the device, and use an ESD wrist strap or mat.
Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures.
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MJH11019G Overview
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