MK24FN256VDC12 - NXP

MK24FN256VDC12 Details

• Manufacturer Part Number:

  MK24FN256VDC12

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  XFBGA-121

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M4

• Clock Frequency-Max:

  50 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• Format:

  FLOATING POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B121

• JESD-609 Code:

  e1

• Length:

  8 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  16

• Number of I/O Lines:

  83

• Number of Serial I/Os:

  7

• Number of Terminals:

  121

• Number of Timers:

  22

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA121,11X11,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  262144

• ROM (words):

  262144

• ROM Programmability:

  FLASH

• Seated Height-Max:

  0.5 mm

• Speed:

  120 MHz

• Supply Current-Max:

  44.67 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.71 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  8 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC