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MK26FN2M0VMI18 - NXP

Description: Kinetis K26 Sub-Family 180 MHz ARM Cortex-M4F Microcontroller

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PCB Footprints
MK26FN2M0VMI18 - NXP PCB footprint - BGA - BGA - MAPBGA LOW PROFILE 9X9X1.15PKG
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3D Models
MK26FN2M0VMI18 - NXP  - 3D model - BGA - MAPBGA LOW PROFILE 9X9X1.15PKG
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MK26FN2M0VMI18 Details

  • Manufacturer Part Number:

    MK26FN2M0VMI18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-169

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B169

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Terminals:

    169

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA169,13X13,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    262144

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Speed:

    180 MHz

  • Supply Current-Max:

    115.08 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MK26FN2M0VMI18 Frequently Asked Questions (FAQs)

  • The MK26FN2M0VMI18 can operate from -40°C to 105°C, but the recommended operating temperature range is -20°C to 85°C for optimal performance.
  • The MK26FN2M0VMI18 has a flexible clock system that can be configured using the Clock Manager (CLK) module. You can use the CLK module to select the clock source, configure the clock frequency, and enable/disable clock outputs. Refer to the device's reference manual for detailed instructions.
  • The maximum current consumption of the MK26FN2M0VMI18 depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the maximum current consumption is approximately 350 mA at 120 MHz with all peripherals enabled.
  • The MK26FN2M0VMI18 has a DMA controller that can be used to transfer data between peripherals and memory. To use the DMA controller, you need to configure the DMA channel, set the transfer parameters, and enable the DMA transfer. Refer to the device's reference manual for detailed instructions and examples.
  • The MK26FN2M0VMI18 has several reset pins, including the Reset pin (RST), the Power-On Reset pin (POR), and the Brown-Out Reset pin (BOR). The Reset pin is used to reset the device, the Power-On Reset pin is used to reset the device during power-up, and the Brown-Out Reset pin is used to reset the device during a brown-out condition.

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MK26FN2M0VMI18 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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