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MMG3H21NT1 - NXP

Description: RF Amplifier 20.5DBM 19.5DB RF GenPurp Amp

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PCB Footprints
MMG3H21NT1 - NXP PCB footprint - Other - Other - SOT89a
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3D Models
MMG3H21NT1 - NXP  - 3D model - Other - SOT89a
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MMG3H21NT1 Details

  • Manufacturer Part Number:

    MMG3H21NT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 1514-02, SOT-89, 3 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    18.3 dB

  • Input Power-Max (CW):

    12 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Frequency-Max:

    6000 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TO-243

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Supply Current-Max:

    110 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

MMG3H21NT1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power supply lines as short as possible and use a common mode choke to reduce EMI.
  • Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Also, consider using a thermal interface material to improve heat transfer.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature protection, over-voltage protection, and over-current protection to prevent damage.
  • Use a low-dropout linear regulator or a switching regulator with a high power conversion efficiency. Optimize the PCB layout to minimize power losses and use a low-power mode when possible.
  • Use ESD protection diodes or TVS diodes on the input and output pins. Implement a robust PCB design with a solid ground plane and a separate power plane to reduce ESD susceptibility.

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MMG3H21NT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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