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MML09212HT1 - NXP

Description: RF Amplifier LNA p9GHZ 21P1 2st 3X3 1

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PCB Footprints
MML09212HT1 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN3*3
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3D Models
MML09212HT1 - NXP  - 3D model - Quad Flat No-Lead - QFN3*3
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MML09212HT1 Details

  • Manufacturer Part Number:

    MML09212HT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    35 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Frequency-Max:

    1400 MHz

  • Operating Frequency-Min:

    400 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Supply Current-Max:

    178 mA

  • Surface Mount:

    YES

  • Technology:

    HEMT

  • Terminal Finish:

    MATTE TIN

MML09212HT1 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN11542. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • The input capacitor values depend on the input voltage, output voltage, and output current. NXP recommends using X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a voltage rating of 1.5 times the input voltage. Refer to the application note AN11542 for more details.
  • The MML09212HT1 has an operating temperature range of -40°C to 150°C. However, the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure proper thermal management to prevent overheating and reduce the risk of device failure.
  • Yes, the MML09212HT1 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow NXP's guidelines for qualification, testing, and validation to ensure the device meets the specific application requirements.
  • NXP provides a troubleshooting guide in their application note AN11542. Common issues can be caused by incorrect PCB layout, inadequate thermal management, or incorrect input/output capacitor selection. Refer to the application note for step-by-step troubleshooting procedures.

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MML09212HT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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