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MP3H6115A6U - NXP

Description: MP3H6115A, 15 to 115 kPa, Absolute, Integrated Pressure Sensor

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MP3H6115A6U - NXP - PCB symbol
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PCB Footprints
MP3H6115A6U - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 98ARH99066A REV H 8 SSOP
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3D Models
MP3H6115A6U - NXP - 3D model - Small Outline Packages - 98ARH99066A REV H 8 SSOP
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MP3H6115A6U Details

  • Manufacturer Part Number:

    MP3H6115A6U

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, SSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Accuracy-Max (%):

    1.5%

  • Additional Feature:

    TEMPERATURE COMPENSATED, SIGNAL CONDITION

  • Body Breadth:

    7.36 mm

  • Body Height:

    3.93 mm

  • Body Length or Diameter:

    7.36 mm

  • Housing:

    PLASTIC

  • Linearity (%):

    1.5 %

  • Mounting Feature:

    SURFACE MOUNT

  • Offset-Nom:

    0.12V

  • Operating Current-Max:

    8 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    0.12-2.82V

  • Output Type:

    ANALOG VOLTAGE

  • Package Shape/Style:

    SQUARE

  • Port Type:

    HOLE

  • Pressure Range-Max:

    16.7 Psi

  • Pressure Range-Min:

    2.2 Psi

  • Pressure Sensing Mode:

    ABSOLUTE

  • Response Time:

    1000 µs

  • Sensors/Transducers Type:

    PRESSURE SENSOR,PIEZORESISTIVE

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

MP3H6115A6U Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Use a Pi-filter topology with a common-mode choke and a differential-mode inductor. Ensure the filter components are placed close to the IC and use a ground plane to reduce radiation.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to ensure stable voltage regulation.
  • Implement a thermal management strategy, such as heat sinking or thermal interface materials, to keep the junction temperature below 125°C. Ensure proper PCB design and layout to minimize thermal resistance.
  • Use ESD protection diodes on all input and output pins, and ensure a low-impedance path to ground. Implement a robust PCB design with a solid ground plane and minimal signal routing near the IC.

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MP3H6115A6U Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image MP3H6115A6T1 Freescale Semiconductor

Piezoresistive Sensor, Absolute, 2.2Psi Min, 16.7Psi Max, 1.50%, 0.12-2.82V, Square, Surface Mount
Part Image MP3H6115A6U Freescale Semiconductor

Piezoresistive Sensor, Absolute, 2.2Psi Min, 16.7Psi Max, 1.50%, 0.12-2.82V, Square, Surface Mount