MPC555LFMZP40 - NXP

MPC555LFMZP40 Details

• Manufacturer Part Number:

  MPC555LFMZP40

• Part Life Cycle Code:

  Obsolete

• Package Description:

  PBGA-272

• Country Of Origin:

  Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Date Of Intro:

  1997-09-16

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Additional Feature:

  IT ALSO OPERATES AT 5 V

• Address Bus Width:

  24

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  MPC500

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• External Data Bus Width:

  32

• Format:

  FLOATING-POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B272

• JESD-609 Code:

  e0

• Length:

  27 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of External Interrupts:

  8

• Number of I/O Lines:

  101

• Number of Serial I/Os:

  4

• Number of Terminals:

  272

• Number of Timers:

  3

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA272,20X20,50

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  235

• Qualification Status:

  Not Qualified

• RAM (bytes):

  26624

• ROM (words):

  458752

• ROM Programmability:

  FLASH

• Seated Height-Max:

  2.65 mm

• Speed:

  40 MHz

• Supply Current-Max:

  250 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  HCMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Lead/Silver (Sn/Pb/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC