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MPC755BPX300LE - NXP

Description: End of Life - 360PBGA,REV2.8,HIP4DP,105CPackage:BGA360, plastic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.77 mm bodyProduct:Archived content is no longer updated and is made available for historical reference only.

The MPC755 and MPC745 Host Processors are high-performance, low-power, 32-bit implementations of the Reduced Instruction Set Computer (RISC) architecture, specially enhanced for embedded applications. MPC755 and MPC745 processors differ only in that the MPC755 featu

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MPC755BPX300LE Alternates

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Part Number

Model

MPC755BRX300 NXP Semiconductors

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360

PC755CMZFU300LE Atmel Corporation

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360

PC755VGSU300LE Teledyne e2v

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360

PC755MZFU300LE Teledyne e2v

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360

PCX755MGU300LE Teledyne e2v

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360

For a full list of alternate parts for MPC755BPX300LE, check out Findchips.com


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Image	Part Number	Model
	MPC755BRX300 NXP Semiconductors RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360
	PC755CMZFU300LE Atmel Corporation RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360
	PC755VGSU300LE Teledyne e2v RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360
	PC755MZFU300LE Teledyne e2v RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360
	PCX755MGU300LE Teledyne e2v RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360
For a full list of alternate parts for MPC755BPX300LE, check out Findchips.com

MPC755BPX300LE - NXP

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

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Moulded Polarised

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Small Outline Diode

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MPC755BPX300LE Alternates