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MPC8555EVTAPF - NXP

Description: End of Life - PQ 37 LITE 8555EPackage:BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.75 mm bodyProduct:The MPC8555E PowerQUICC<sup>&#174;</sup>.TM) III host processor integrates a wide range of advanced NXP<sup>&#174;</sup> technologies, modular cores and peripherals.

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MPC8555EVTAPF Overview

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