MSCMMX6DZCK08AB - NXP
Description: No Longer Manufactured - Package:TFBGA500S, thin fine-pitch ball grid array package; 500 terminals, 0.65 mm pitch, 14 mm x 17 mm x 0.925 mm bodyProduct:Single Chip Module-i.MX 6DThe SCM-i.MX 6Dual integrates the i.MX 6Dual processor, PMIC PF0100, 16 MB SPI NOR flash, over a hundred passive components and is enabled for a 1 or 2 GB LPDDR2 as a PoP configuration.
ECAD model is currently unavailable for this part
