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MSCSM120AM027CD3AG - Microchip

Description: Discrete Semiconductor Modules PM-MOSFET-SIC-SBD-D3

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MSCSM120AM027CD3AG Details

  • Manufacturer Part Number:

    MSCSM120AM027CD3AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.50.00.80

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Case Connection:

    ISOLATED

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    733 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    0.23 pF

  • JESD-30 Code:

    R-XUFM-X7

  • Number of Elements:

    2

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2970 W

  • Pulsed Drain Current-Max (IDM):

    1400 A

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

MSCSM120AM027CD3AG Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout and thermal management guide in their application note AN2005, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal performance and thermal dissipation.
  • The MSCSM120AM027CD3AG has built-in overcurrent protection, but it's recommended to implement external fault detection and protection circuits to ensure reliable operation. Microchip's application note AN2006 provides guidance on implementing overcurrent protection and fault detection using external components and circuitry.
  • Microchip provides guidelines for soldering and assembly in their document 'Assembly and Soldering Guidelines for Microchip Packages' (DS50002314A). It's essential to follow these guidelines to ensure reliable connections and prevent damage to the device.
  • To ensure EMC and reduce EMI, follow Microchip's guidelines for PCB layout, component selection, and shielding in their application note AN2007. Additionally, consider using EMI filters and shielding components to minimize radiation and susceptibility.
  • Microchip provides reliability and quality metrics for the MSCSM120AM027CD3AG in their reliability report (RR1200A). This report includes data on failure rates, MTBF, and other quality metrics to help engineers assess the device's reliability in their application.

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MSCSM120AM027CD3AG Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like MSCSM, or try a keyword search, such as Power Field-Effect Transistors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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