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MURB1660CTG - onsemi

Description: Short Heat Sink Tab Manufactured - Not Sheared!; High Voltage Capability to 600 V; 175°C Operating Junction Temperature; Similar in Size to Industrial Standard TO-220 Package Mechanical Characteristics:; Low Leakage Specified @ 150°C Case Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Weight: 1.7 grams (approximately); Package Designed for Power Surface Mount Applications; Lead and Mounting Surface Temperature for Soldering Purp

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MURB1660CTG Details

  • Manufacturer Part Number:

    MURB1660CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK 2 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    418B-04

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Recovery Time-Max:

    0.06 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MURB1660CTG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
  • The maximum allowed voltage transient on the input pins is ±5V, but it's recommended to limit transients to ±2V to ensure reliable operation.
  • Yes, but ensure the device is properly bypassed and decoupled to minimize voltage ringing and oscillations. Also, consider the device's SOA (Safe Operating Area) and thermal limitations.
  • Use TVS (Transient Voltage Suppressor) diodes or ESD protection devices on the input pins, and consider adding a fuse or PTC (Positive Temperature Coefficient) thermistor for overcurrent protection.

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MURB1660CTG Overview

Use the download button to access the MURB1660CTG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MURB1, or try a keyword search, such as Rectifier Diodes

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