NCV47411PAAJR2G footprint, schematic symbol and 3D model by onsemi

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Part Number NCV47411PAAJR2G
Manufacturer onsemi
Pin Count 14
Part Category Accelerometer
Package Category Small Outline Packages
Footprint Name Small Outline Packages - TSSOP−14 Package
Pinout / Pin List Click Here (Member Only)

NCV47411PAAJR2G Details

Manufacturer Part Number:
NCV47411PAAJR2G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TSSOP-14 EP
Package Description:
TSSOP-14
Pin Count:
14
Manufacturer Package Code:
948AW
Country Of Origin:
Thailand
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
9 Weeks
Manufacturer:
onsemi
YTEOL:
6.6
Adjustability:
ADJUSTABLE
Dropout Voltage1-Max:
0.55 V
Dropout Voltage1-Nom:
0.25 V
Dropout Voltage2-Max:
0.55 V
JESD-30 Code:
R-PDSO-G14
JESD-609 Code:
e3
Length:
5 mm
Load Regulation-Max(%):
1.8%
Moisture Sensitivity Level:
1
Number of Functions:
2
Number of Outputs:
2
Number of Terminals:
14
Operating Temperature TJ-Max:
150 °C
Operating Temperature TJ-Min:
-40 °C
Output Current1-Max:
0.1 A
Output Current2-Max:
0.1 A
Output Voltage1-Max:
20 V
Output Voltage1-Min:
3.3 V
Output Voltage2-Max:
20 V
Output Voltage2-Min:
3.3 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTSSOP
Package Equivalence Code:
TSSOP14,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Regulator Type:
ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR
Seated Height-Max:
1.2 mm
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
4.4 mm

NCV47411PAAJR2G Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-40°C to 150°C). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
The recommended soldering conditions for NCV47411PAAJR2G are: peak temperature 260°C, time above 217°C 30 seconds, and time above 183°C 90 seconds. Use a soldering iron with a temperature range of 350°C to 400°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
To handle ESD protection for NCV47411PAAJR2G, ensure that the device is handled in an ESD-protected environment, and use ESD-protective packaging and materials. Use an ESD wrist strap or mat when handling the device, and avoid touching the device's pins or leads.
The recommended storage conditions for NCV47411PAAJR2G are: temperature range -40°C to 35°C, relative humidity 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, clean environment.

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