Description:High Speed (up to 1 Mbps); Compatible with the ISO 11898−2 Standard; VIO Pin on NCV7351D13 Version Allowing Direct Interfacing with 3V to 5V Microcontrollers; EN Pin on NCV7351D1E Version Allowing Switching the transceiver to a Very Low Current OFF Mode; Excellent Electromagnetic Susceptibility (EMS) Level Over Full Frequency Range. Very Low Electromagnetic Emissions (EME) Low EME also Without Common Mode (CM) Choke; Bus Pins Protected Against >15 kV System ESD Pulses; Transmit Data (TxD) Dominant Time−out
A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
The NCV7351D10R2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
Yes, the NCV7351D10R2G is qualified for automotive and high-reliability applications. However, it's essential to review the device's AEC-Q100 qualification and to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for the expected behavior, verify the PCB layout and component selection, and use a current probe or oscilloscope to measure the current and voltage waveforms.
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NCV7351D10R2G Overview
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