NRVTS560ETFSWFTAG - onsemi
Description: Fine Lithography Trench−based Schottky Technology for Very Low Leakage; Fast Switching with Exceptional Temperature Stability; Low Power Loss and Lower Operating Temperature; Low Thermal Resistance; Higher Efficiency for Achieving Regulatory Compliance; High Surge Capability; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Wettable Flanks (WF in PM Suffix) Option Available for Enhanced Automated Optical Inspection (
ECAD model is currently unavailable for this part
