The recommended land pattern for the NTCS0603E3103HMT is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0603E3103HMT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0603E3103HMT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
Yes, the NTCS0603E3103HMT is compatible with lead-free soldering. It is RoHS-compliant and can be soldered using lead-free soldering processes.
The NTCS0603E3103HMT has a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels without special handling or storage requirements.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
NTCS0603E3103HMT Overview
Use the download button to access the NTCS0603E3103HMT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTCS0,
or try a keyword search, such as Non-linear Resistors
