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NVD3055-150T4G-VF01 - onsemi

Description: AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVD3055-150T4G-VF01 - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) CASE 369C ISSUE-G
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NVD3055-150T4G-VF01 Details

  • Manufacturer Part Number:

    NVD3055-150T4G-VF01

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2019-05-13

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    30 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    28.8 W

  • Power Dissipation-Max (Abs):

    28.8 W

  • Pulsed Drain Current-Max (IDM):

    27 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    75 ns

  • Turn-on Time-Max (ton):

    105 ns

NVD3055-150T4G-VF01 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • The device requires a stable input voltage (VIN) and a bias voltage (VBIAS) to operate correctly. Ensure that VIN is within the recommended range (12V to 15V) and VBIAS is set to 5V ± 10%.
  • The maximum allowed current through the output pins is 150mA per pin. Exceeding this limit may cause damage to the device or affect its reliability.
  • Use a TVS diode or a zener diode to protect the device from overvoltage conditions. Add a current-limiting resistor or a fuse to prevent overcurrent conditions.
  • The recommended storage temperature range for the device is -40°C to 125°C. Storing the device outside this range may affect its reliability or cause damage.

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NVD3055-150T4G-VF01 Overview

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