P82B96DP - NXP

P82B96DP Details

• Manufacturer Part Number:

  P82B96DP

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  3 MM, PLASTIC, SOT-505-1, TSSOP-8

• Pin Count:

  8

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Interface IC Type:

  BUS BUFFERS

• JESD-30 Code:

  S-PDSO-G8

• JESD-609 Code:

  e4

• Length:

  3 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  2

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP8,.19

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max:

  15 V

• Supply Voltage-Min:

  2 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  BIPOLAR

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  3 mm