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PEX8619-BA50BCG - Avago Technologies

Description: Control Plane, Embedded Systems, Fanout, Intelligent I/O Interface 324-HSBGA (19x19)

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PEX8619-BA50BCG - Avago Technologies PCB footprint - BGA - BGA - 324-BGA
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PEX8619-BA50BCG - Avago Technologies  - 3D model - BGA - 324-BGA
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PEX8619-BA50BCG Details

  • Manufacturer Part Number:

    PEX8619-BA50BCG

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HBGA, BGA324,18X18,40

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Bus Compatibility:

    I2C; PCI; SMBUS; SPI; USB

  • Clock Frequency-Max:

    100 MHz

  • Data Transfer Rate-Max:

    0.0125 MBps

  • Drive Interface Standard:

    IEEE 1149.1; IEEE 1149.6

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

PEX8619-BA50BCG Frequently Asked Questions (FAQs)

  • Broadcom provides a reference design guide and thermal management guidelines in the PEX8619-BA50BCG design guide document, which can be obtained from the manufacturer or a authorized distributor. It's essential to follow these guidelines to ensure optimal performance, signal integrity, and thermal dissipation.
  • Broadcom provides a debugging guide and troubleshooting checklist in the PEX8619-BA50BCG user manual. Additionally, engineers can use tools like logic analyzers, oscilloscopes, and signal generators to debug and troubleshoot issues. It's also recommended to consult with Broadcom's technical support team or a authorized distributor for assistance.
  • The power sequencing and voltage ramp-up requirements are critical for the PEX8619-BA50BCG. Broadcom recommends a specific power-up sequence and voltage ramp-up rate, which can be found in the datasheet and design guide document. It's essential to follow these requirements to prevent damage to the device and ensure proper operation.
  • Broadcom provides compliance testing and certification support for the PEX8619-BA50BCG. Engineers should consult with Broadcom's technical support team or a authorized distributor to ensure compliance with regulatory requirements, such as PCIe and USB specifications. Additionally, it's recommended to perform thorough testing and validation to ensure compliance.
  • The PEX8619-BA50BCG has specific thermal and power derating considerations that must be taken into account during design and operation. Broadcom provides thermal and power derating guidelines in the datasheet and design guide document. Engineers should consult these guidelines to ensure proper thermal management and power dissipation.

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PEX8619-BA50BCG Overview

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