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PI3B3253LEX - Diodes Incorporated

Description: 3.3V, Dual 4:1 Mux/DeMux NanoSwitch

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PI3B3253LEX - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 16-TSSOP-L
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PI3B3253LEX - Diodes Incorporated  - 3D model - Small Outline Packages - 16-TSSOP-L
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PI3B3253LEX Details

  • Manufacturer Part Number:

    PI3B3253LEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBTLV/3B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    2

  • Number of Ports:

    5

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

PI3B3253LEX Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a solid ground plane, short traces, and minimal vias to reduce signal loss and noise. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended. Additionally, the device should be placed close to the power source and the output should be routed away from the input to minimize feedback.
  • The PI3B3253LEX requires a stable power supply with a minimum of 3.3V and a maximum of 5V. A 0.1uF decoupling capacitor should be placed as close as possible to the device's power pins, and an additional 1uF to 10uF capacitor can be added in parallel to filter out high-frequency noise. The power supply should also be able to provide sufficient current to drive the load.
  • The PI3B3253LEX is a high-speed bus switch that can support data rates up to 1 Gbps. However, the actual data rate may be limited by the system's signal integrity, PCB layout, and load capacitance. It's recommended to perform signal integrity analysis and simulation to ensure the device can meet the required data rate.
  • The PI3B3253LEX is designed to handle hot-swapping and hot-plugging, but it's essential to ensure that the device is properly powered down before removing or inserting the load. A power-down sequence should be implemented to prevent damage to the device or the load. Additionally, the device should be protected from overvoltage and overcurrent conditions during hot-swapping or hot-plugging.
  • The PI3B3253LEX has an ESD protection level of ±2kV human body model (HBM) and ±1kV charged device model (CDM). This means the device can withstand electrostatic discharges up to 2kV when handled by a human and up to 1kV when charged by a device. However, it's still recommended to follow proper ESD handling procedures to prevent damage to the device.

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PI3B3253LEX Overview

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