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PI3B3253QEX - Diodes Incorporated

Description: Multiplexer/Demultiplexer 2 x 4:1 16-QSOP

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PCB Footprints
PI3B3253QEX - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 16-QSOP
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PI3B3253QEX - Diodes Incorporated  - 3D model - Small Outline Packages - 16-QSOP
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PI3B3253QEX Details

  • Manufacturer Part Number:

    PI3B3253QEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QSOP-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBTLV/3B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    2

  • Number of Ports:

    5

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

PI3B3253QEX Frequently Asked Questions (FAQs)

  • A good PCB layout for the PI3B3253QEX involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-on and power-off sequencing, it's recommended to follow the power-up and power-down sequences outlined in the datasheet. Additionally, make sure to provide a clean and stable power supply, and use a suitable capacitor value for the VCC pin.
  • The PI3B3253QEX has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, and to keep the device within the recommended operating temperature range.
  • To troubleshoot issues with the PI3B3253QEX, start by checking the power supply voltage, ensuring it's within the recommended range. Then, verify the input and output signals, and check for any signs of overheating or physical damage. If the issue persists, consult the datasheet and application notes for further guidance.
  • Yes, the PI3B3253QEX is a sensitive device and requires proper ESD precautions during handling and assembly. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or exposed internal components.

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PI3B3253QEX Overview

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Part Image IDTQS3VH253QG8 Renesas Electronics Corporation

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Part Image PI3B3253Q Pericom Semiconductor Corporation

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Part Image PI3B3253QX Pericom Semiconductor Corporation

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