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PI6CV304LEX - Diodes Incorporated

Description: Clock Buffer 1:4 PCI (X) Clock Buffer

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PI6CV304LEX Details

  • Manufacturer Part Number:

    PI6CV304LEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 X 3 MM, 1.20 MM HEIGHT, 0.65 MM PITCH, TSSOP-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Family:

    6C

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    3 ns

  • Propagation Delay (tpd):

    3 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.1 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    160 MHz

PI6CV304LEX Frequently Asked Questions (FAQs)

  • A good PCB layout for the PI6CV304LEX involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper power-on and power-off sequencing, the PI6CV304LEX requires a controlled power-up and power-down sequence. The input voltage (VIN) should be applied before the enable signal (EN), and the enable signal should be asserted after VIN has reached its nominal value.
  • The PI6CV304LEX can drive a maximum capacitive load of 10nF. Exceeding this limit may cause instability or oscillations in the output voltage.
  • The PI6CV304LEX has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB. Additionally, ensure good airflow around the device to prevent overheating.
  • The recommended input capacitor value for the PI6CV304LEX is 1uF to 10uF, with a voltage rating of at least 6.3V. A ceramic capacitor with a low ESR is recommended to minimize voltage ripple and ensure stable operation.

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PI6CV304LEX Overview

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Part Image PI6CV304LEX Pericom Semiconductor Corporation

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Part Image PI6CV304LE Pericom Semiconductor Corporation

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Part Image PI6CV304L Pericom Semiconductor Corporation

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