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PMEG045T150EPDZ - Nexperia

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PMEG045T150EPDZ Details

  • Manufacturer Part Number:

    PMEG045T150EPDZ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFP

  • Package Description:

    SOT-1289, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1289

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    45 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    210 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.02 µs

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG045T150EPDZ Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PMEG045T150EPDZ is a thermal pad with a minimum size of 2.5mm x 2.5mm, with a thermal via array underneath to ensure good thermal dissipation.
  • To ensure reliability in high-temperature applications, it is recommended to derate the maximum junction temperature (Tj) by 10°C to 15°C, and to use a thermal interface material (TIM) with a high thermal conductivity to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage transient for PMEG045T150EPDZ is 20% above the maximum rated voltage (150V) for a duration of less than 100ms. Exceeding this limit may cause damage to the device.
  • Yes, PMEG045T150EPDZ can be used in high-frequency switching applications, but it is recommended to use a snubber circuit to reduce electromagnetic interference (EMI) and ensure reliable operation.
  • To calculate the power dissipation of PMEG045T150EPDZ, use the formula: Pd = (Vin - Vout) x Iout x Efficiency, where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Efficiency is the device's efficiency at the operating point.

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PMEG045T150EPDZ Overview

Use the download button to access the PMEG045T150EPDZ 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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