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PUMD10,125 - Nexperia

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PUMD10,125 Details

  • Manufacturer Part Number:

    PUMD10,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 21

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

PUMD10,125 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMD10,125 near a thermal pad or a heat sink, ensuring good thermal conductivity. The layout should also minimize thermal resistance by using wide copper tracks and avoiding thermal bottlenecks.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the PUMD10,125 involve using a soldering iron with a temperature of 250°C to 270°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point above 217°C to ensure reliable joints.
  • To protect the PUMD10,125 from electrical overstress (EOS), it's essential to follow proper handling and storage procedures, such as avoiding electrostatic discharge (ESD) and using antistatic packaging. Additionally, consider using voltage clamping devices, such as transient voltage suppressors (TVS), to limit voltage transients.
  • The PUMD10,125's reverse voltage rating of 1250 V implies that the device can withstand a maximum reverse voltage of 1250 V without breaking down. This rating is essential for ensuring the device's reliability in applications where reverse voltage spikes may occur.

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PUMD10,125 Overview

Use the download button to access the PUMD10,125 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMD1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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