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Q6008LTTP - LITTELFUSE

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Q6008LTTP - LITTELFUSE  - 3D model
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Q6008LTTP Details

  • Manufacturer Part Number:

    Q6008LTTP

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC, ISOLATED TO-220AB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

  • Critical Rate of Rise of Commutation Voltage-Min:

    4 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    100 V/us

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    2

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    8 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    TRIAC WITH INT TRIGGER

Q6008LTTP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the Q6008LTTP is a rectangular pad with dimensions of 0.070 inches (1.78 mm) x 0.030 inches (0.76 mm) with a 0.020 inches (0.51 mm) radius corner. It's essential to follow the recommended footprint to ensure proper thermal performance and reliability.
  • While the Q6008LTTP has a high-temperature rating of 150°C, it's essential to consider the derating curve and ensure that the device does not exceed its maximum junction temperature (Tj) of 150°C. Additionally, the device's performance may degrade at high temperatures, so it's crucial to evaluate its performance under the specific operating conditions.
  • To ensure proper soldering, follow the recommended soldering profile, which includes a peak temperature of 260°C (500°F) for 10-15 seconds. Use a solder with a melting point of 217°C (423°F) or higher, and ensure the PCB is clean and free of oxidation. Avoid using excessive solder or flux, as this can compromise the device's reliability.
  • To prevent damage or degradation, store the Q6008LTTP in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the body, avoiding touching the leads or electrical contacts to prevent electrostatic discharge (ESD) damage.
  • While the Q6008LTTP is designed to be robust, it's essential to evaluate its performance under the specific vibration or shock conditions. Littelfuse recommends following the recommended mounting and PCB design guidelines to ensure the device's reliability in high-vibration or high-shock environments.

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Q6008LTTP Overview

Use the download button to access the Q6008LTTP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like Q6008, or try a keyword search, such as TRIACs

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