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QS32XL384Q1G8 - Renesas Electronics

Description: The QS32XL384 provides a set of twenty high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS32XL384 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Four Bus Enable signals are provided, one for each of five bits of the 20-bit bus. The QS32XL384 is ideal for switching wide digital buses, as well as hot-docking, 5V to 3V conversion and capacitance isolation for power conservation. The QS32XL384 operates at

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QS32XL384Q1G8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DJG48
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QS32XL384Q1G8 - Renesas Electronics  - 3D model - Small Outline Packages - DJG48
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QS32XL384Q1G8 Details

  • Manufacturer Part Number:

    QS32XL384Q1G8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QVSOP

  • Package Description:

    QVSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    DJG48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    TTL COMPATIBLE BUS SWITCH

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    5

  • Number of Functions:

    4

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP48,.24,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.006 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

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QS32XL384Q1G8 Overview

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