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QS32XVH2245Q2G8 - Renesas Electronics

Description: The QS32XVH2245 HotSwitch is a high bandwidth, 16-bit bus switch. The QS32XVH2245 is ideal for line matching and low noise environments. The switches can be turned ON under the control of the LVTTL-compatible Output Enable (OEx) signal for bidirectional data flow with no added delay or ground bounce. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS32XVH2245 ideal for hot-swapping applications. The QS32XVH2245 operates from -40C to +85C.

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QS32XVH2245Q2G8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DMG40
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QS32XVH2245Q2G8 - Renesas Electronics  - 3D model - Small Outline Packages - DMG40
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QS32XVH2245Q2G8 Details

  • Manufacturer Part Number:

    QS32XVH2245Q2G8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QVSOP

  • Package Description:

    QVSOP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    DMG40

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 2.5V SUPPLY

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G40

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP40,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    1.35 ns

  • Propagation Delay (tpd):

    1.35 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

QS32XVH2245Q2G8 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guide for the QS32XVH2245Q2G8, which includes recommendations for PCB layout, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal thermal performance and reliability.
  • To optimize power consumption, use the device's power modes (e.g., Sleep, Deep Sleep, and Hibernate) and adjust the clock frequency, voltage, and peripheral usage accordingly. Additionally, use the Renesas Synergy Configurator tool to generate optimized code for power management.
  • Follow Renesas' EMC/EMI design guidelines, which include recommendations for PCB layout, component placement, and shielding. Ensure proper decoupling, filtering, and grounding to minimize EMI and improve EMC.
  • Use Renesas' Secure Firmware Update (SFU) and Secure Boot (SB) features, which provide a secure environment for firmware updates and boot processes. Implement cryptographic techniques, such as encryption and digital signatures, to protect firmware and data.
  • Consult Renesas' environmental and reliability data, which includes information on operating temperature range, humidity, and vibration tolerance. Ensure proper PCB design, component selection, and packaging to withstand harsh environments.

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QS32XVH2245Q2G8 Overview

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