RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
Yes, the RAM-1205S is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's recommended to follow proper mounting and screw torque procedures to ensure the module remains securely attached to the PCB.
The RAM-1205S meets various safety and regulatory standards, including UL60950-1, EN60950-1, and IEC60950-1. However, it's recommended to consult with RECOM's technical support team to ensure the module meets your specific requirements, such as custom testing or certification for your application.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range of the module. The capacitor should be placed as close as possible to the input pins of the module to minimize noise and ripple.
Yes, the RAM-1205S can be paralleled to increase output power, but it's recommended to consult with RECOM's technical support team to ensure proper design and implementation. The modules should be connected in parallel with identical output capacitors and load sharing resistors to ensure equal current distribution.
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RAM-1205S Overview
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