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RB521ZS-30T2R - ROHM Semiconductor

Description: ROHM 30V 100mA, Diode, 2-Pin GMD, SOD-962 RB521ZS-30T2R

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RB521ZS-30T2R - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB521ZS-30T2R - ROHM Semiconductor PCB footprint - Other - Other - GMD2
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RB521ZS-30T2R Details

  • Manufacturer Part Number:

    RB521ZS-30T2R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN0603-2, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

RB521ZS-30T2R Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a heat sink or thermal interface material, and ensure good airflow around the device. Consider derating the device's power dissipation according to the ambient temperature.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Consider adding vibration dampening materials or potting the device for added reliability.
  • Verify the input voltage, output load, and feedback resistors. Check for any signs of overheating, and ensure the device is properly soldered and connected. Consult the datasheet and application notes for specific troubleshooting guidelines.

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RB521ZS-30T2R Overview

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