ROHM provides a recommended PCB layout in their application note (AN1911) for thermal optimization. It suggests using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
To ensure reliability, follow the recommended operating conditions, derating, and thermal management guidelines provided in the datasheet. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature and implement over-temperature protection if necessary.
ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device is compatible with lead-free soldering processes, and ROHM provides a detailed soldering profile in their application note (AN1911).
The RBQ20BM65ATL is rated for operation in environments with a relative humidity of up to 60% at 40°C (104°F). For higher humidity environments, consider using a moisture-resistant coating or conformal coating to protect the device.
Store the RBQ20BM65ATL in a dry, cool place with a relative humidity of 50% or less at a temperature range of 5°C to 30°C (41°F to 86°F). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage.
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RBQ20BM65ATL Overview
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