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RBR20BM30ATL - ROHM Semiconductor

Description: ROHM RBR20BM30ATL Dual SMT Schottky Diode, 2x Common Cathode Pair, 30V 20A, 3+Tab-Pin TO-252

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RBR20BM30ATL - ROHM Semiconductor - PCB symbol
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RBR20BM30ATL - ROHM Semiconductor PCB footprint - Other - Other - RBR20BM40ATL-1
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RBR20BM30ATL Details

  • Manufacturer Part Number:

    RBR20BM30ATL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-63, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.51 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    300 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RBR20BM30ATL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 1oz copper thickness and a thermal via diameter of 0.3mm to ensure optimal heat dissipation.
  • To ensure reliability, follow the recommended derating curves, and consider using a heat sink or thermal interface material to reduce the junction temperature. Also, ensure that the device is operated within the specified absolute maximum ratings.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
  • While the RBR20BM30ATL is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure that the device is properly sealed, and consider using a moisture-resistant coating or conformal coating to prevent moisture ingress.
  • Store the devices in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing devices in direct sunlight or near heat sources.

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RBR20BM30ATL Overview

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RBR20BM30ATL Alternates

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Part Image RBR20BM30A ROHM Semiconductor

Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 30V V(RRM), Silicon, TO-252