The recommended PCB layout for optimal thermal performance involves placing the DC-DC converter near a thermal vias or a heat sink, and ensuring good airflow around the component. A minimum of 2oz copper thickness is recommended for the PCB to help dissipate heat.
To ensure EMC, it is recommended to follow proper PCB design and layout guidelines, use a metal shield or enclosure, and add EMI filters or ferrite beads to the input and output lines. Additionally, the module should be placed at least 10mm away from other components to minimize electromagnetic interference.
The derating curve for the REC20-25-201-1 is not explicitly provided in the datasheet, but it can be obtained by contacting Nidec Copal Electronics Corporation directly or through an authorized distributor. The derating curve provides information on the module's performance at different temperatures and input voltages.
The REC20-25-201-1 is designed to withstand moderate vibration, but it is not suitable for high-vibration environments. If your application requires operation in a high-vibration environment, you may need to consider additional mechanical support or a different module specifically designed for high-vibration applications.
The MTBF of the REC20-25-201-1 is typically provided in the reliability report, which can be obtained by contacting Nidec Copal Electronics Corporation directly or through an authorized distributor. The MTBF is usually calculated based on the module's operating conditions, such as temperature, humidity, and input voltage.
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REC20-25-201-1 Overview
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