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RGP30M - Diotec

Description: Rectifiers Diode, Fast, DO-201, 1000V, 3A, 150C

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Symbol
RGP30M - Diotec - PCB symbol
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PCB Footprints
RGP30M - Diotec PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - RGP30M*
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3D Models
RGP30M - Diotec - 3D model - Diodes, Axial Diameter Horizontal Mounting - RGP30M*
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RGP30M Details

  • Manufacturer Part Number:

    RGP30M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-201

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-201

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    110 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.5 µs

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RGP30M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • The RGP30M is rated for operation up to 150°C. To ensure reliable operation, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • A soldering profile with a peak temperature of 260°C to 280°C and a dwell time of 10-30 seconds is recommended. The device should be soldered using a solder with a melting point above 217°C to ensure reliable connections.
  • Yes, the RGP30M is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated according to the specific industry standards and requirements.
  • The RGP30M has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent EOS and ESD damage. This includes using ESD-safe materials, handling the device by the body or using an ESD wrist strap, and avoiding overvoltage conditions during operation.

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RGP30M Overview

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