The recommended land pattern for the RMCF1210FTR100 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the RMCF1210FTR100 should be placed on a flat, even surface to prevent warping or tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is a peak temperature of 260°C with a dwell time of 20-30 seconds.
The RMCF1210FTR100 has an operating temperature range of -55°C to 150°C, with a derating of 1.33% per degree Celsius above 125°C.
The RMCF1210FTR100 should be stored in a dry, cool place with a relative humidity of less than 60%. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.
The recommended soldering method for the RMCF1210FTR100 is reflow soldering using a lead-free solder alloy with a melting point of 217°C to 220°C. Wave soldering is not recommended due to the risk of thermal shock.
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RMCF1210FTR100 Overview
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