The recommended land pattern for the RSF2JT100R is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The RSF2JT100R has a high power rating, so thermal considerations are crucial. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. The component's thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
The RSF2JT100R has an operating temperature range of -55°C to +150°C. However, the component's power rating is derated above 125°C, so ensure that the component does not exceed this temperature during operation.
To ensure the reliability of the RSF2JT100R in high-vibration environments, use a secure mounting method such as soldering or adhesive bonding. Additionally, consider using a component with a higher vibration rating or adding mechanical support to the component.
The recommended soldering profile for the RSF2JT100R is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the component is not exposed to temperatures above 280°C, as this can cause damage to the internal structure.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
RSF2JT100R Overview
Use the download button to access the RSF2JT100R 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like RSF2J,
or try a keyword search, such as Metal Oxide Film Resistors
