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S29AL008J55BFIR10 - Spansion

Description: Architectural Advantages  Single Power Supply Operation – Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications  Manufactured on 110 nm Process Technology – Fully compatible with 200 nm S29AL008D

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S29AL008J55BFIR10 - Spansion PCB footprint - BGA - BGA - S29AL008D55BAIR12
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S29AL008J55BFIR10 Details

  • Manufacturer Part Number:

    S29AL008J55BFIR10

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    BGA

  • Package Description:

    BGA-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Spansion

  • Access Time-Max:

    55 ns

  • Additional Feature:

    TOP BOOT BLOCK

  • Alternate Memory Width:

    8

  • Boot Block:

    TOP

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    20

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8.15 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    1,2,1,15

  • Number of Terminals:

    48

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA48,6X8,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Reverse Pinout:

    NO

  • Seated Height-Max:

    1 mm

  • Sector Size:

    8K,4K,16K,32K

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    6.15 mm

  • Write Cycle Time-Max (tWC):

    0.000055 ms

  • Write Protection:

    HARDWARE/SOFTWARE

S29AL008J55BFIR10 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the S29AL008J55BFIR10 is -40°C to +85°C.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation. During hold, the device will tri-state its outputs and ignore any input signals.
  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the input signals. The power-down sequence should be the reverse of the power-up sequence.
  • The device density is 8Mb (1Mb x 8) and the organization is x8 (8 bits per byte). This information can be found in the device's part number and datasheet.
  • The WREN instruction sets the Write Enable Latch (WEL) to enable write operations, while the WRDI instruction resets the WEL to disable write operations. This is a security feature to prevent accidental or unauthorized writes to the device.

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S29AL008J55BFIR10 Overview

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