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S3K - onsemi

Description: Glass passivated junction.; Low profile package.

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PCB Footprints
S3K - onsemi PCB footprint - Other - Other - SMC CASE 403AG
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3D Models
S3K - onsemi  - 3D model - Other - SMC CASE 403AG
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S3K Details

  • Manufacturer Part Number:

    S3K

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    800 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    2.6 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2.5 µs

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S3K Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to the ground plane to improve heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Use a shielded enclosure, keep sensitive analog circuits away from the S3K, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure that the PCB layout is designed to minimize radiation and susceptibility.
  • Use the lowest possible voltage supply, minimize the switching frequency, and optimize the PCB layout to reduce parasitic capacitance and inductance. Also, consider using a low-dropout regulator to reduce power consumption.
  • Monitor the device temperature, voltage, and current. Also, implement over-temperature, over-voltage, and over-current protection to prevent damage to the device.

Trust Checks

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S3K Overview

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Part Image S3K-E3/57T Vishay Semiconductors

Rectifier Diode, 1 Phase, 1 Element, 3A, 800V V(RRM), Silicon, DO-214AB

Part Image S3K+ SPC Multicomp

Rectifier Diode, 1 Phase, 1 Element, 3A, 800V V(RRM), Silicon

Part Image S3K-E3/9AT Vishay Semiconductors

DIODE 3 A, 800 V, SILICON, RECTIFIER DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Rectifier Diode

Part Image S3K-GT3 Sangdest Microelectronics (Nanjing) Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 800V V(RRM), Silicon, DO-214AB

Part Image S3K Diodes Incorporated

Rectifier Diode, 1 Phase, 1 Element, 2.5A, 800V V(RRM), DO-214AB

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