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S6006LS2TP - LITTELFUSE

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S6006LS2TP - LITTELFUSE  - 3D model
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S6006LS2TP Details

  • Manufacturer Part Number:

    S6006LS2TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.43

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    8 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    6 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.25 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    6000 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    6 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S6006LS2TP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable soldering, Littelfuse recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. The component should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
  • The S6006LS2TP has a maximum surge current rating of 100 A, which is specified in the datasheet. However, it's essential to note that the surge current rating is dependent on the ambient temperature and the device's operating conditions.
  • While the S6006LS2TP is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance. It's recommended to consult with Littelfuse's application engineers for specific guidance on high-frequency applications.
  • Littelfuse recommends storing the S6006LS2TP in its original packaging or in a dry, clean environment with a relative humidity of 50% or less. The device should be handled with care to avoid mechanical stress, and it's recommended to use anti-static packaging and handling procedures to prevent electrostatic discharge damage.

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S6006LS2TP Overview

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