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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR1006-100ML
- Part Number SDR1006-100ML
- Manufacturer Bourns
- Pin Count 2
- Last Modified Date Jan 20, 2025 8:52 AM UTC
- Pinout / Pin List Click Here (Member Only)
SDR1006-100ML Details
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Manufacturer Part Number:
SDR1006-100ML
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
12 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
6.25
SDR1006-100ML Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SDR1006-100ML is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a minimum of 0.5 mm clearance around the component body.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pad, and place the component on the pad. Use a gentle touch to avoid applying excessive pressure, which can damage the component.
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The SDR1006-100ML has an operating temperature range of -40°C to 125°C. However, it's recommended to derate the component's power rating by 1.5% per degree Celsius above 80°C to ensure reliable operation.
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Yes, the SDR1006-100ML is designed to withstand high-vibration environments. However, it's recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening to prevent movement during vibration.
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Store the SDR1006-100ML in its original packaging or a similar ESD-protective package. Handle the component by the body, avoiding touching the leads or electrical contacts. Use an anti-static wrist strap or mat when handling the component to prevent ESD damage.
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SDR1006-100ML Overview
Use the download button to access the SDR1006-100ML 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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