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SDR6603-470M - Bourns

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SDR6603-470M - Bourns  - 3D model
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SDR6603-470M Details

  • Manufacturer Part Number:

    SDR6603-470M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.6

  • Case/Size Code:

    2618

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.64 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.92 mm

  • Package Length:

    6.6 mm

  • Package Style:

    SMT

  • Package Width:

    4.45 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    0.5 A

  • Self Resonance Frequency:

    14 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER NICKEL GOLD

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SDR6603-470M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal track lengths is recommended. Keep the input and output tracks separate and avoid crossing them over each other.
  • Use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, both connected between the input and ground pins, as close to the device as possible.
  • The SDR6603-470M can operate safely between -40°C to +125°C, but the inductance value may vary by ±15% over this temperature range.
  • Yes, but be aware that the core losses will increase with frequency. Use the datasheet's core loss curves to estimate the losses and ensure the device operates within its thermal limits.
  • Avoid bending, flexing, or applying excessive mechanical stress to the device. Use a sturdy PCB and ensure the device is securely mounted to prevent movement or vibration.

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SDR6603-470M Overview

Use the download button to access the SDR6603-470M 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SDR66, or try a keyword search, such as Fixed Inductors

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