FREE WHEELING DIODE, HIGH RELIABILITY, LOW POWER LOSS
Application:
EFFICIENCY
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.7 V
JEDEC-95 Code:
DO-15
JESD-30 Code:
O-PALF-W2
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
50 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
2 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
600 V
Reverse Recovery Time-Max:
0.035 µs
Surface Mount:
NO
Terminal Finish:
PURE TIN
Terminal Form:
WIRE
Terminal Position:
AXIAL
SF28 Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing thermal vias under the SF28 package, using a solid copper plane on the top and bottom layers, and ensuring a minimum of 2oz copper thickness. Additionally, it's recommended to use a thermal pad on the bottom of the package and to connect it to a thermal plane or a heat sink.
To handle the SF28's high current requirements during startup, it's recommended to use a bulk capacitor with a low ESR (Equivalent Series Resistance) and a high capacitance value (e.g., 10uF to 22uF) placed close to the SF28. This helps to reduce voltage droop and ensure a stable power supply during startup.
The maximum allowed PCB temperature for the SF28 is 125°C, as specified in the datasheet. However, it's recommended to keep the PCB temperature below 100°C to ensure optimal performance and reliability.
To ensure EMC with the SF28, it's recommended to use a shielded enclosure, keep the SF28 away from other noise-sensitive components, and use a common-mode choke or ferrite bead on the input power lines. Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility to electromagnetic interference.
The recommended soldering process for the SF28 involves using a reflow soldering process with a peak temperature of 260°C to 270°C, and a dwell time of 30 seconds to 60 seconds. It's also recommended to use a solder paste with a high melting point and a low voiding tendency.
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SF28 Overview
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